Aluminum Nitrides

rod made for electrically insulating aluminum nitride ceramic
Aluminum Nitride — AlN
Combining excellent thermal conductivity and high thermal shock resistance with superior electrical insulation, aluminum nitrides provide electrical insulation while also dissipating heat effectively in applications where other ceramics are prone to thermal shock. Typical applications include high temperature, high-intensity light emitting diodes (LEDs), and semiconductor manufacturing equipment applications.

Primary Features

  • Thermal conductivity
  • Thermal stability and shock resistance
  • Electrically insulative
  • Plasma resistance

Applications

  • Semiconductor manufacturing equipment components
  • Electronic substrates
  • Heater components
  • Transportation components

Aluminum nitride substrates for use in LED electronics as they dissipate heat Aluminum nitride slotted disc for use in the semiconductor manufacturing equipment as it dissipated heat and insulates exceptionally well.Technical ceramic aluminum nitride valve discs are injection molded by the thousands per day.Precision aluminum nitride ceramic components for use in high-performance machineryAluminum nitride ceramic component for cooling boxes in rail vehicles to ensure reliable, safe, and durable operation

Materials

  • KMT-AN180 — 96% AlN (gray)
  • KMT-AN200 — 96% AlN (gray)
  • KMT-AN220 — 97% AlN (beige)

Material Properties for KemaTek Aluminum Nitrides

Properties Units Test Aluminum Nitride — AlN
Material Name KMT-AN180 KMT-AN200 KMT-AN220
Color Gray Gray Beige
Primary Material Content 96% AlN 96% AlN 97% AlN
Characteristics High thermal conductivity, excellent thermal shock and plasma resistance
Applications Heat dissipating components, plasma-resistant components
Bulk Density g/cc ASTM-C20 3.30 3.30 3.28
Water Absorption % ASTM-C373 0 0 0
Vickers Hardness (Load 500 g) GPa ASTM-C1327-03 10.0 9.5 9.0
Flexural Strength MPa ASTM-C1161-02c ≥350 ≥325 ≥280
Compressive Strength MPa ASTM-C773 2500 2500 —
Young’s Modulus of Elasticity GPa ASTM-C1198-01 320 320 320
Poisson’s Ratio — ASTM-C1198-01 0.24 0.24 0.24
Fracture Toughness MPa * m12 ASTM-C1421-01b (Kevron notched beam) — — —
Coefficient of Linear Thermal Expansion, 40-400 ℃ x 10-6/℃ ASTM-C372-94 4.8 4.6 4.5
Thermal Conductivity, 20℃ W/(m • K) ASTM-C408-88 180 200 220
Specific Heat J/(Kg • K) x 103 ASTM-E1269 0.74 0.74 0.76
Thermal Shock Resistance ℃ Note 1 — — —
Volume Resistivity, 20℃ Ω • cm ASTM-D257-99 ≥1014 ≥1014 ≥1013
Dielectric Strength KV/mm ASTM-D149-97 ≥15 ≥15 ≥15
Dielectric Constant, 1 MHz — ASTM-D150-98 (1 MHz) 9.0 8.8 8.6
Loss Tangent (x 10-4 ASTM-D150-98 (1 MHz) 5.0 5.0 3.0

Technical ceramics material properties chart
Ceramic Materials Properties Chart — All Materials — PDF, 128K

For more information or to get a quote on your next refurbishment project, please contact us.